ABLESTIK JM7000具有高可靠性，低空洞特點(diǎn)，耐高溫可達(dá)370度。
常用超大規(guī)模集成電路封裝，陶瓷焊接封裝和焊接密封封裝
樂泰EA 3335透明UV耐熱耐水耐腐蝕光通訊光路膠
粘度 5000-7000cp 固化條件 UV 硬度80shoreA Tg值 135℃ CTE,低于Tg溫度59ppm/℃ CTE,Tg值溫度 ppm/℃
透明，UV快速固化，良好的耐熱，耐水，耐化學(xué)腐蝕性，低揮發(fā)。
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE RV-20 Rotoviscometer, mPa·s (cP):
Cone 1o @ Shear rate 22 s
-1 9,000
Work Life @ 25°C, hours 8 to 16
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Suggested temperature cures are from 150 to 350oC. For
applications requiring higher electrical conductivity, a cure cycle of 15
minutes @ 300oC is recommended. Product properties will not be
reduced by subsequent post die attach thermal exposure, i.e.,
wirebond, and/or lid seal up to 370oC.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Thermal Expansion, :
Below Tg, ppm/°C 33
Glass Transition Temperature (Tg) by TMA, °C 240
Bulk Thermal Conductivity, W/(m-K):
@ 90°C 1.1
@ 165°C 1.0
Tensile Modulus, DMTA :
Cured 30 minutes @ 300oC N/mm2 10,000
(psi) (1,450,377)
Extractable Ionic Content, @ 100°C:
Chloride (Cl-) <10
Sodium (Na+) <15
Potassium (K+) <15
Decomposition (in N2):
TGA analysis @ 10oC/ minute ramp from 25 to 400
oC
@ 340oC, % 0.2
@ 400oC, % 0.3
Electrical Properties
Sample cured 30 minutes @ 300oC
Volume Resistivity, ohm-cm ≤0.01
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150oC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300oC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300oC
Chip Size: ROC
15 x 15 mm > 5
BLETHERM 2600AT高導(dǎo)熱導(dǎo)電銀膠 黏 度： 8.5 PaS 剪切強(qiáng)度： - Mpa 工作時間： 1440 min 工作溫度： - ℃ 保 質(zhì) 期： 12 個月 固化條件： 30分鐘升到200°C + 15分鐘 @ 200°C 主要應(yīng)用： 大功率LED
HENKEL ABLETHERM 2600AT粘合劑是一款特別為芯片需要高散而開發(fā)的芯片粘接膠,如大功率和和散熱元?dú)饧? 本粘合劑是一種特的懸浮液-銀和樹脂顆粒懸浮在溶劑載體中. 一旦膠水完全固化,溶劑也會干掉, 本粘合劑含有很高比重的銀. 本品主要用于高功率,高導(dǎo)熱的大功率發(fā)光二極管.
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